The companies collaborated to deliver a comprehensive hierarchical thermal analysis solution for TSMC 3DFabric using RedHawk-SC Electrothermal TSMC enabled Ansys RedHawk-SC™ for power integrity (EM/IR ...
PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These ...
PITTSBURGH, June 28, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) announces that Samsung Foundry has certified Ansys' RedHawk power integrity and thermal verification platform for Samsung's family of ...
Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
uPI achieves a 2X improvement in thermal cycle endurance for their semiconductor product packages with Ansys' multiphysics simulation solutions Ansys' predictive simulation insights enable uPI to ...
System design and system integration have taken on a whole new meaning with the latest trends in mobile and wearable computing. Integrating the compute power formally associated with super-computers ...
...and Flir Defense launches portable chemical detector for rapid narcotics analysis – including fentanyl. Perception engineers can leverage thermal imaging data with computer simulations. Improving ...
The next generation of chips on the 10/7nm finFET processes will be able to cram more devices into same area while also boosting performance, but there’s a price to pay for that. The 3D fin structures ...
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