Electronic devices, including those in telecommunications and high-power systems, generate heat during normal operation. That heat must be dissipated to avoid junction temperatures exceeding tolerable ...

Thinner fins employed in ultra-high ratio extrusion heat sinks for power semiconductors provide more surface area per unit width, at lower cost than their predecessors. Also, they reduce air flow back ...

Ever-increasing levels of heat in today's power electronics necessitate constant efforts to increase heat sink efficiency by expanding the number of extended surfaces (fins) for cooling. Due to the ...

In recent years, increases in processing power mean advanced semiconductor devices now dissipate astounding levels of power. For many applications, cooling these devices has become a major challenge.

If you have high-powered LEDs, or a power supply, or are trying to control larger motors, you have to get a lot of heat out of your circuit boards. The classic way to dissipate heat is to bolt your ...

Available in footprints from 2.0 x 2.0 in. to 5.0 x 5.0 in. and heights from 0.7 to 2.0 in., a line of aluminum heat sinks uses a novel flared pin-fin design that minimizes friction to improve natural ...

[Peter Wirasnik] has been casting his own aluminum heat sinks. He’s working on capturing the heat from a car’s exhaust system and turning it into electricity, kind of like the candle generator. In the ...

The use of liquid metal for processor cooling is a popular method among some firms and users, as demonstrated by the PlayStation 5. However, it is not suitable for all situations because liquid metal ...

The PowerSite attachment lets power semiconductors mount directly onto heat sinks without mechanical fasteners. The PowerSite process selectively bonds insulated copper pads onto aluminum heat sinks.