Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...
Customers can now access more capabilities and capacity for expanded production methods, simplifying custom mechanical sourcing. SAN FRANCISCO, Jan. 17, 2024 /PRNewswire/ -- Fictiv, a global ...
Predominantly, if the metal part used in compression molding is tension or compression loaded, a ratio of metal part thickness to its extensional modulus, multiplied by the Bulk Molding Compound (BMC) ...
When engineers at General Dynamics Armament and Technical Products (GDATP) recently designed the ammunition container for a new aircraft weapon system, they decided very early in the process to make ...
The hybrid-composite rear load floor uses unidirectional (UD) thermoplastic tapes plus direct-long-fiber thermoplastic (D-LFT) composites. Thermoplastic tapes provided high stiffness/strength in a ...