http://www.coolinnovations.comWhile today's high-end ICs offer exceptional processing capabilities, they also generate heavy loads of heat. Providing adequate cooling ...

Electronic devices, including those in telecommunications and high-power systems, generate heat during normal operation. That heat must be dissipated to avoid junction temperatures exceeding tolerable ...

A line of hybrid pin-fin heat sinks are made from an array of forged aluminum pin-fin heat sinks that are reflowed onto a copper plate. The hybrid pin fins are available in a wide array of standard ...

New heat spreading tech delivers 740% increase in circuit power density By Loz Blain May 22, 2022 Experimental configurations showed outstanding cooling capability for the central conformal copper ...

Designed to cool surface-mount devices (SMDs) dissipating high heat loads, as well as those featuring small and focused heat sources, the UltraCool IV line of copper heatsinks employ pin fins with low ...

Increasing the processing power of electronic equipment often means that more transistors have to be squeezed into tighter packages. And higher circuit densities increase the amount of heat that must ...

If you have high-powered LEDs, or a power supply, or are trying to control larger motors, you have to get a lot of heat out of your circuit boards. The classic way to dissipate heat is to bolt your ...

Package heat spreaders can offer a variety of benefits such as protection of the silicon, warpage management, increased reliability, and thermal enhancement, however, there are tradeoffs for every ...

Apple recently took the wraps off its iPhone 15 series at its Fall event. The top flagship models reported overheating issues soon after, and several reports hinted that it could be due to its ...

The FanlessVC2300S is a passively cooled computer that measures 360 x 303 x 130mm (14.2″ x 11.9″ x 5.1″) and has an internal volume of 14.2 liters. But what makes the system impressive is that it has ...