HSINCHU, Taiwan--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

We’ve covered the Tiny Tapeout project a few times on these pages, and while getting your digital IC design out there onto actual silicon for a low cost is super cool, it is still somewhat limited.

United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond Electronics to ...

The AI-powered Copilot hardware design tool provides a chatbot-like assistant with a wealth of knowledge at your fingertips. What is Copilot and how does it use AI? The capabilities of Copilot.

Achieving efficiency in integrated circuit (IC) design while maintaining design quality is not just a goal, but a necessity. Designers constantly strive to strike a balance between ever-tightening ...