ERFURT, Germany--(BUSINESS WIRE)--X-FAB Silicon Foundries, the leading More-than-Moore foundry, today introduced XS018, the first specialized 0.18µm CMOS process for fast and large image sensor pixels ...
Designers rely on the accuracy of Process Design Kits (PDK¡¦s) for their IC designs. This paper describes independent verification of the PDK accuracy using a low-cost Die Level Process Monitor (DLPM) ...
In 1958, the first integrated circuit flip-flop was built using two transistors at Texas Instruments. The chips of today contain more than 1 billion transistors. The memory that could once support an ...
Toshiba Adds Family of High-Voltage Power MOSFETs Using Advanced π-MOS VII Process Technology for AC/DC and Ballast Applications 500V and 600V MOSFETs Combine Advanced Process Technology with ...
Sub-5 nm logic nodes will require an extremely high level of innovation to overcome the inherent real-estate limitations at this increased device density. One approach to increasing device density is ...
Compare 3 process flows in terms of robustness to process variation to see which one has the lowest likelihood of processing failures. Sub-5 nm logic nodes will require an extremely high level of ...
NOTTINGHAM, England--(BUSINESS WIRE)--A UK collaboration between Nottingham-based start-up, Search For The Next (SFN) and Glenrothes-based Semefab may be set to disrupt the semiconductor industry by ...
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