The PowerSite attachment lets power semiconductors mount directly onto heat sinks without mechanical fasteners. The PowerSite process selectively bonds insulated copper pads onto aluminum heat sinks.

Thermally conductive thermoplastics for heat sinks and thermal management dissipate the same amount of heat as aluminum but are up to 50% lighter. They also have no antenna effect (no amplification of ...

When choosing an effective heat sink, engineers usually consider its price, size, weight, performance and other features. But equal care should be given to deciding how the heat sink will be attached ...

When facing the task of cooling heavily populated PCBs (printed-circuit boards), de-signers must understand that careful management of airflow along the boards is the key to effective cooling. In ...

Electronic devices, including those in telecommunications and high-power systems, generate heat during normal operation. That heat must be dissipated to avoid junction temperatures exceeding tolerable ...

Cost-effective burn-in-with-test is essential to produce high reliability components. To ensure uniform burn-in of all components, a test solution must control the temperature, voltage, power, test ...

In recent years, increases in processing power mean advanced semiconductor devices now dissipate astounding levels of power. For many applications, cooling these devices has become a major challenge.