A new technique for fabricating liquid cooling channels onto the backs of high-performance integrated circuits could allow denser packaging of chips while providing better temperature control and ...
A new technique for fabricating liquid cooling channels onto the backs of high-performance integrated circuits could allow denser packaging of chips while providing better temperature control and ...
Microsoft has reported the successful testing of a new cooling system for data centres that outperforms current technologies. According to a report by Catherine Bolgar on Microsoft's official website, ...
Data center rack density has risen rapidly in recent years. Operators are cramming more computing power into each server rack to meet the needs of AI and other high-performance computing applications.
The chips that datacenters use to run the latest AI breakthroughs generate much more heat than previous generations of silicon. Anybody whose phone or laptop has overheated knows that electronics ...
Microsoft reported today it has successfully tested a new cooling system that removed heat up to three times better than cold plates. The system is called microfluidics, an approach that brings liquid ...
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