Molex has introduced its family of VersaBeam expanded beam optical (EBO) interconnect solutions. These high-density fiber connectors, optimized for hyperscale data center, cloud and edge computing ...

Heilind Electronics, a leading global distributor of interconnect, electromechanical, and industrial automation products, now offers the Molex MMCX Power-over-Coax (PoC) Connector, an innovative ...

Molex, a global electronics leader and connectivity innovator, has launched its Impress Co-Packaged Copper Solutions to meet the needs of next-generation data centers and AI workflows by delivering ...

Molex has introduced the first product in its new eHV high-voltage connector and terminal system portfolio, aimed at delivering secure and reliable electrical connections for high-voltage applications ...

Systems supporting PCIe 7.0 interconnections with a 128 GT/s transfer rate are years away. However, companies like Molex, which specializes in connectors, are already working on connectors and cabling ...

Molex has unveiled a miniature waterproof connector which it claims is the first and only sealed wire to wire system of its size certified to IP67 standard. The Mizu-P25 connector is 2.5mm is ...

Molex has shrunk its Fit family of wire-to-PCB connectors – to 3.5mm pin-pitch to produce the Ultra-Fit range – the size of the one pictured, looking straight into the pins, is 10 x 14mm. For single ...

Molex has announced two families of FFC/FPC connectors designed to add high-reliability to small-pitch. Dubbed Easy-On FFC/FPC connectors they are available in 0.5mm pitch and 1.0mm pitch formats.

Molex claims the industry’s first SMT potting wire-to-board connector system with the introduction of the Spot-On 1.5 and 2.0. Molex believes that the new potting system will provide increased ...

Molex Inc., a maker of electronic components for Apple Inc.’s iPhone and other products, agreed to a $7.2-billion acquisition by Koch Industries Inc., the holding company controlled by the billionaire ...

This Microwaves & RF article is reprinted here with permission. With mobile and consumer products becoming ever-smaller and thinner, OEMs feel greater pressure to simplify communications within the ...