The first article in this series titled “The common silicon issues in analog IP integration” focused on system-on-chip (SoC) design issues related to incorporating analog IP. Here we begin expanding ...

As the AI and HPC markets develop, high-performance computing is rapidly growing, driving the demand for high-speed transmission. Naturally, the complexity of chip design has also increased ...

The previous articles in this series showed how the successful integration of IP—especially analog/RF, but digital as well—is essentially pre-determined by the practices of the chip development team ...

Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence (AI), 5G/6G ...

SAN JOSE, Calif., 02 Jul 2012-- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced it has acquired Sigrity, Inc., a leading signal and power ...

CARLSBAD, Calif.--(BUSINESS WIRE)--Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a leader in dispensing, jetting, and coating equipment and technologies, introduces the Quantum™ Q-6800 ...

Groomed for high density PCB packaging, the company’s latest surface-mount retainer accepts all ML414 micro lithium batteries from all major manufacturers and is compatible with all soldering and ...

A new miniature, screw-terminaltype binding post handles 22 to 15-awg wire and high-density PCB packaging A new miniature, screw-terminaltype binding post handles 22 to 15-awg wire and high-density ...

An intelligent patch for cardiac monitoring is amongst research projects built on flexible and stretchable PCBs from Würth Elektronik. There are two cardiac monitors, a mini version with three ...

PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology with multi-layer redistribution layers (RDL).