E+E Elektronik will showcase sensor solutions that help operators and system integrators optimize processes in measurable ...

According to a report from Korea JoongAng Daily, the Taylor, Texas, fab has been delayed with pilot production now slated to be completed by the end of 2026. Pilot production is considered a major ...

Applied Materials Inc. and Micron Technology are collaborating to develop next-generation DRAM, high-bandwidth memory (HBM) and NAND memory that increase energy efficiency performance in AI systems.

According to a report from Reuters, Japan has set a goal of $253.6 billion in annual sales by 2040, up from roughly $50.3 billion in 2025. This is an extension of the original target of $94.4 billion ...

APEC has quickly become one of the pre-eminent events on the electronics industry calendar. The booming power electronics market offers significant opportunity, and the conference draws a large ...

The companies will use IBM’s research facilities at the NY Creates Albany NanoTech Complex and will utilize Lam’s end-to-end process tools and innovations including Aether dray resist technology, Kiyo ...

Broadcom Inc.’s 3 nm 400 G/lane optical PAM-4 digital signal processor (DSP) is now available, designed for next generation ...

Starlink, in a partnership with Deutsche Telekom, will bring mobile communications to areas where network expansion is ...

The collaboration addresses one of the most significant challenges in large-scale electrification: reducing energy losses and ...

Shimadzu Scientific Instruments has introduced an on-line total organic carbon (TOC) analyzer designed to meet ultrapure ...

Arduino launched its latest platform at Embedded World 2026 called Ventuno Q, powered by Qualcomm Dragonwing IQ-8 series. Arduino, which was acquired by Qualcomm in October of 2025, said the single ...

GOWIN Semiconductor has launched its next-generation Arora GW1AN and GW3A field-programmable gate array (FPGA) families, ...