For spectrum analyzers lacking a tracking generator, this broadband RF noise source is affordable and will help measure a ...

Ambarella brings its edge AI SoC portfolio to Embedded World with live demos spanning robotics, industrial automation, ...

Siemens has introduced the Questa One Agentic Toolkit, adding domain-scoped agentic AI workflows to its verification ...

As digital data streams increase in speed and data rate, losses in PCB traces become ever more of a bottleneck. Moving optics ...

Renesas brings its new RH850/U2C 32-bit automotive MCU to Embedded World 2026 next week, with live demos at Hall 1, Stand 234 ...

Rambus Inc. has released its HBM4E Controller IP designed for next-generation AI accelerators and high-performance computing.

Physical artificial intelligence (PAI) is the application of AI and machine learning (ML) algorithms to enable autonomous ...

Infineon takes the floor at Embedded World 2026 in Nuremberg, March 10 – 12 (Hall 4A, Booth 138) with live demonstrations ...

For both personal and professional reasons, I follow a lot of articles, summaries, news feeds, and published papers related to engineering, physics, and science. One thing I have noticed in the past ...

The single-crimp N-Type connectors from Amphenol RF are designed for field installation using a one-step ferrule crimp that eliminates separate contact crimping. Rated IP67 when mated, the connectors ...

GPUs, ASICs, and other AI processors require enormous amounts of power delivered at low voltages and high currents.

NEXCOM heads to Embedded World 2026 in Nuremberg next week with a lineup spanning AI-edge computing, robotics, and smart city platforms. The centerpiece is the APPC C21-01 series. These fanless panel ...